In the quiet arithmetic of manufacturing economics, Samsung has chosen pragmatism over prestige — stepping back from the sophisticated Fan-Out Wafer-Level Packaging that elevated its Exynos chips since 2400, and turning instead toward a simpler Side-by-Side design for the Exynos 2700. The decision, which will shape the processors inside the Galaxy S27 and S27+ arriving in early 2027, reflects a truth as old as industry itself: that the most technically impressive path is not always the one a company can afford to walk. Heat Pass Block technology will attempt to soften the thermal trade-off, th
GSMArena.com
· May 16, 2026
· technology
· 1 min read
Medium
Sourcing: Characterized
Samsung's Exynos 2700 ditches costly FOWLP for new Side-by-Side packaging
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Business
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Bias & Framing
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Geopolitical Impact
🌎
Samsung's chipset design shift from FOWLP to cheaper Side-by-Side packaging reflects cost-cutting in semiconductor manufacturing, with minimal geopolitical significance.
Escalation Risk
low
Confidence
HIGH
Economic Lens
📈
Samsung shifts Exynos 2700 to cheaper Side-by-Side packaging, sacrificing thermal performance for manufacturing cost reduction and improved profitability.
Market Signal
mixed
Confidence
MED
Semiconductor Manufacturing
Consumer Electronics
Mobile Device Industry
Packaging Technology
Thermal Management Solutions
Consumers may experience potential thermal management trade-offs in Galaxy S27 devices. While cost savings could theoretically lower device prices, Samsung's historical pricing suggests margins will improve rather than prices declining. Performance throttling under sustained load is a risk if HPB technology proves insufficient compensation.
Potential regulatory scrutiny on thermal safety standards for mobile devices. May prompt industry-wide packaging standardization discussions. Could influence environmental policies regarding chip manufacturing efficiency and waste reduction in semiconductor production.